
Unlike other standard versions of large motherboard systems, the Summit LXi platform is a rework system designed for large PCB rework, offering an optimized solution for large PCB repair processes.The new enhanced control system of the LXi eliminates the impact of facility variations and supports more precise calibration, allowing process parameters to be easily shared across multiple systems.
Despite the miniaturization of surface-mount technology and the increasing demands for enhanced signal speed and functionality in circuit assembly, the result has been that many components and PCBs have become larger and heavier. To meet the rework needs of these components, VJ Electronix offers the Summit LXi Large Board Automated Rework System.
The Summit LXi is equipped with an X-Y table and a board holder that can accommodate PCBs up to 24" x 36" (610mm x 915mm), along with an 8kW convection chamber bottom heater for heat transfer. Increased top and bottom side gaps of 2.75 inches (70mm) and2.0 inches (51mm), along with an optical system providing an 80mm square field of view, enable easy handling of very large components.
All established unique features, such as advanced automatic configuration, programmable options, and force application via component height sensing, are integrated. The system also includes independent top heaters and pick-up tubes, patented split imaging, precise placement capabilities, optical/digital zoom, and automatic data/event
logging. Optional features, such as local solder point (bottom) automatic heater sweeping and an ultra-high power 10kW bottom heater, are available for challenging applications.
With unparalleled large board handling capabilities and industry-recognized standards, the Summit LXi is the preferred choice for reworking area array components on PCBs—such as BGA, μBGA, CSP, PoP, and SMD—up to 24" x 36".

Copyright @2025 Dachang Foreign Trade (Shanghai) Co., Ltd. Shanghai ICP No.18032167-3
Shanghai Public security No.31011502009866 Shanghai(Pu) Emergency Management Hazard License[2020]203567(FYS)