Description: A ceramic material composed of aluminum oxide, with a typical concentration of 96-99.6%. Its hardness increases with the concentration of aluminum oxide, offering high resistance and high thermal resistance, high mechanical strength, good electrical characteristics, and low dielectric loss at high frequencies. Typical thickness ranges from 0.1 to 5.0 mm.

Main Considerations: 

Cutting Quality: 

• Chipping 

• Cracks

Cutting Equipment:

Automatic (7120 series)or fully automatic (7220 series) cutting (slicing) systems, featuring a very high level of automation,comprehensive process control capabilities, large-sized blades upto 5 inches, achieving better cost of ownership, automatic heightcompensation, and increased production volume.

Blade: 

• 2", 3", and 4" resin blades, "Q", "R", and "C" substrates

• Diamond grit size: 45 - 88 microns 

• Thickness: 0.006" - 0.012"

Process Parameters: 

 • Cutting speed: 4-20 mm/sec 

 • Spindle speed: 2" and 3": 20-30 krpm; 4": 10 - 16 krpm

Description: 

Green ceramic, basic capacitor, composed of two conductive electrodes separated by an insulating dielectric material. Multilayer ceramic capacitors consist of numerous densely packed parallel electrodes between thin layers of high-permittivity ceramic material.

Main Considerations: 

• "Dry" cutting operations generate dust that can cause disturbances. 

• Blade clogging. 

• Chipping and layer loss.

Cutting Equipment: 

Model 7124, highly automated, with large-sized blades, reducing production costs.

Blade: 

• 4" Nickel (standard or serrated edge) and steel core nickel blades 

• Diamond grit size: 30 - 70 microns 

• Thickness: 0.006" - 0.014"

Process Parameters:

• Cutting speed: 50-250 mm/sec 

• Spindle speed: 12-18 krpm 

• "Dry" cutting and "wet" cutting 

• Frequent grinding of the blade to clean up the chips

Description: 

Printed Circuit Board (PCB) Surface Acoustic Wave Device (SAW) Amorphous silicon in a non-crystalline form, characterized by being hard, brittle, and transparent without decoration, serves as a substrate for various applications. Specific types include fused silica glass, borosilicate glass, and alkali-free glass. Typical thickness ranges from 0.3 to 5 mm, with or without protective and optical coatings.

Main Considerations: 

Cutting Quality: 

• Top and back side chipping 

• Cutting perpendicularity 

• Blade mark surface treatment

Cutting Equipment:

Models 7122 and 7124, highly automated, equipped with process control tools, optimized blade size, up to 5 inches, achieving lower production costs.

Blade:

• "2" and 4" resin blades with "Q" and "E" substrates, Novus sintered blades "I" series

• Diamond grit size: 15-53 microns (resin resin), 6 -25 microns(sintered)

• Thickness: 0.002"-0.012"

Process Parameters: 

• Cutting speed: 2-15 mm/sec

• Spindle speed: 2": 18-30 krpm; 4": 8 - 16 krpm 

• Cutting additives can reduce chipping and improve surface finish

Description: 

Printed Circuit Board (PCB) Surface Acoustic Wave Device (SAW)  Lead zirconate titanate (PZT) is a type of ceramic material with piezoelectric properties (the material generates charge due to deformation/pressure). Common applications include ultrasonic imaging in the medical industry. In most applications, PZT is cut vertically to form a series of shallow notches.

Main Considerations: 

• Very tight blade mark width tolerance

• Blade mark perpendicularity

• Side wall chipping

• Edge breakage

• High aspect/thickness ratio

Cutting Equipment:

Model 7122, featuring a very high level of automation, high precision, and equipped with comprehensive process control tools.

Blade:

• "2" wheel or annular nickel blades, "P" substrate

• Diamond grit size: 3-6 to 6-8 microns

• Thickness:0.0008"-0.0030'

Process Parameters: 

• Cutting speed: 1-6 mm/sec 

• Spindle speed: 20-30 krpm

Description: 

Printed Circuit Board (PCB) is composed of copper layers and FR4/5 or BT resin, serving as a mounting substrate. The typical thickness ranges from 0.3 mm to 2 mm.

Main Considerations: 

Cutting Quality: 

• Copper burrs 

• Chippings

Cutting Equipment: 

Automatic (7120 series) or fully automatic (7220 series) cutting (slicing) systems, featuring a very high level of automation, capable of handling large areas, equipped with comprehensive process control tools.

Blade: 

• 2" and 4" nickel blades (serrated and standard edges), "T", "V", and "Z" substrates 

• Diamond grit size: 10, 13 - 17 microns 

• Thickness: 0.003" - 0.008"

Process Parameters: 

• Cutting speed: 50-150 mm/sec 

• Spindle speed: 2": 25-30 krpm; 4": 12 - 20 krpm

Description: 

Surface Acoustic Wave (SAW) components utilize piezoelectric materials to convert acoustic waves (mechanical waves) into electromagnetic signals, or vice versa. Currently, common SAW components are SAW band-pass filters (SAW BPF), which sort signals based on frequency. The widely used substrate materials are brittle materials such as quartz (SiO2), lithium niobate (LiNbO3), and lithium tantalate (LiTaO3).

Main Considerations: 

Cutting Quality: 

• Chipping edges

Cutting Equipment: 

Automatic (7120 series) or fully automatic (7220 series) cutting (slicing) systems, featuring a very high level of automation and comprehensive process control capabilities.

Blade: 

• Quartz: 

   ◦ 2" resin blades with "Q", "K", and "Z" substrates, 25-53 microns 

• Lithium niobate and Lithium tantalate: 

   ◦ 2" resin blades with "Q" and "K" substrates, 9 - 30 microns 

   ◦ 2" nickel wheel blades, 4-8 microns

Process Parameters: 

• Quartz: 

   ◦ Cutting speed: 2-10 mm/sec

   ◦ Spindle speed: 25-30 krpm 

• Lithium niobate and Lithium tantalate: 

   ◦ Cutting speed: 0.1-5 mm/sec

   ◦ Spindle speed: 25-30 krpm